The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Generally, the single panel is composed of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. Also used for high-end use is designed as a double panel, the structure is circuit layer, insulation layer, aluminum base, insulation layer, circuit layer. A very small number of applications are multi-layer boards, which can be made of ordinary multi-layer boards combined with an insulating layer and an aluminum base.
Simply speaking, the aluminum substrate manufacturer is the PCB, which is also the meaning of the printed circuit board. The material of the circuit board is aluminum alloy. The material of our general circuit board is glass fiber, but because the LED heat is large, the LED The circuit board for lamps is generally an aluminum substrate, which can conduct heat quickly, and the circuit board for other equipment or electrical
appliances is still a fiberglass board!
Now aluminum substrate manufacturers will tell you how it works.
The surface of the power device is mounted on the circuit layer, and the heat generated by the device is quickly conducted to the metal base layer through the insulating layer, and then the heat is transferred by the metal base layer to achieve heat dissipation of the device.
How do aluminum substrate manufacturers survive?
Compared with the conventional FR-4, the aluminum substrate can minimize the thermal resistance and make the aluminum substrate have excellent thermal conductivity. Compared with the thick film ceramic circuit, its mechanical properties are extremely excellent.
In addition, aluminum substrates have the following unique advantages:
Meet RoHs requirements;
More suitable for SMT process;
Extremely effective treatment of thermal diffusion in the circuit design, thereby reducing module operating temperature, extending service life, increasing power density and reliability;
Reduce the assembly of heat sinks and other hardware (including thermal interface materials), reduce product size, reduce hardware and assembly costs; optimize power circuit and control circuit combination;
Replace the fragile ceramic substrate for better mechanical durability.
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