Technic　Specifications/Process Capacity
01. Customer supply information: film, model, CAD data, E-MAIL,MODEN.
02. Copper plate: FR-4, CEM-3. Aluminum substrate Copper substrate
03. Thickness: 0.2-3.0MM
04. Number of wiring layers: single, double, multi-layer (3-12)
05. Minimum aperture: 0.2 MM
06. The thinnest wire/pitch: 5mil/5mil (Ni/Au) plate 6mil/6mil (spray Sn/Pb plate)
07. Surface treatment: gold plating, tin spraying, anti-oxidation, sinking tin, sinking silver
08. Maximum processing size: 600*1200mm
09. Solder Mask: Thermosetting Oil, Photographic Oil
10. Shape processing capability: milling, punching, cutting, V-CUT, accuracy: plus or minus 0.15mm
11. Monthly processing capacity: 12,000 square meters
12. Daily processing capacity: 600 square meters
13. Delivery period: 5-10 days
14. Maximum thickness / aperture ratio: less than 5